Single-Wafer Clean

Wafer cleaning is a critical function that must be repeated many times during the semiconductor manufacturing process. It is required during all major stages of device fabrication: front-end-of-line (FEOL), back-end-of-line (BEOL), and advanced packaging. As device geometries shrink and new materials are introduced, the number of cleaning steps continues to grow at an aggressive rate. Furthermore, each step has different selectivity and defectivity requirements that add to manufacturing complexity. The need to clean fragile structures without causing damage is a key driver for chipmakers who are turning to single-wafer wet clean processing technology for next-generation devices. In addition, semiconductor manufacturers are paying increased attention to the wafer edge as a source of yield-limiting defects. By including cleaning steps that target the bevel region, the number of good die at the wafer’s edge can be increased to maximize yield.

Spin Wet Clean
DV-Prime^® Da Vinci^®SP Series

With the acquisition of the SEZ Group in March 2008, Lam Research expanded its portfolio to include single-wafer spin clean systems. First introduced over 20 years ago, Lam’s single-wafer spin technology for cleaning and removing films has pioneered the industry transition from batch to single-wafer wet processing. This proven core technology provides the productivity and flexibility needed for both high-volume manufacturing and leading-edge development across multiple technology nodes and for all device types. The spin clean approach provides excellent process uniformity across the wafer, wafer-to-wafer, and lot-to-lot. By offering the latest in dilute chemistry and solvent systems, Lam Research continues to meet defectivity and material integrity requirements. Lam’s yield-enabling spin clean systems are configurable for a range of applications, including particle, polymer, and residue removal, substrate thinning, photoresist removal, and backside and bevel cleaning.

Plasma-Based Bevel Clean
2300^® Coronus^®

The 2300 Coronus plasma-based bevel clean system incorporates Lam’s extensive plasma expertise to remove yield-limiting defect sources. The system combines the ability of plasma to selectively remove a wide variety of materials with a proprietary confinement technology that protects the die area. Incorporating Lam’s Dynamic Alignment technology on the production-proven 2300 platform, the Coronus system provides highly accurate wafer placement for reproducible results and superior encroachment control. Designed to remove a wide range of material types, the system supports multiple applications throughout the manufacturing process flow – including post-shallow trench isolation (STI), gate, bit line, and BEOL damascene etch.