Process Expertise

Semiconductor wafers are subjected to a complex series of process steps that result in the simultaneous creation of many individual integrated circuits. The etch processes that Lam equipment supports are critical to the successful manufacture of the semiconductor industry's highest—performing devices — which are also the most challenging to fabricate.

Etch Processes
Etch processes are repeated numerous times during the fabrication cycle and are required to manufacture every type of semiconductor device produced today. The etch process defines linewidths and other microscopic features on integrated circuits. Plasma etching was developed to meet the demand for device geometries smaller than 3 microns. Plasma processes remove dielectric, metal, or polysilicon material and produce the finely delineated features and patterns of an integrated circuit.

Today, manufacturers of advanced integrated circuits require etch systems that create features of 0.13 micron (130 nm) and below. In addition, systems capable of producing devices with feature sizes below 100 nm are now needed to develop processes for future semiconductor products. The trend toward feature sizes in the 100 nm range accompanies a transition from aluminum to copper conductive lines for faster device processing speeds. Subsequent feature size reductions below 100 nm will begin to integrate more fragile dielectric materials (low k and porous low k).

In addition to shrinking feature sizes continually, advanced manufacturing facilities are now producing integrated circuits on 200 mm (8 inch) silicon wafers and transitioning to wafer diameters of 300 mm (12 inches). To accommodate these decreasing linewidths and increasing wafer diameters, semiconductor manufacturers will increasingly require more precise control over the etch process.

Lam's etch systems employ the Company's patented TCP™ high—density and DFC™ medium—density plasma sources to etch conductive (metal and silicon) and insulating (dielectric) materials for device features to 100 nm or smaller.

Additional information on the Company and recent milestones are listed on the Facts and Figures page.