2300 Exelan® Flex™ — Dielectric Etch

The key manufacturing challenges facing dielectric etch for future sub 90 nm technologies are dealing with increased complexity of device architectures, the introduction of increasingly porous low k materials, the continued introduction of new, more fragile 193 nm photoresist materials, and the need to continually reduce manufacturing costs in an increasingly competitive market. The 2300 Exelan Flex is uniquely positioned to extend the capabilities of the 2300 Exelan to continue to address today's manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs.

Building on the award—winning success of the 2300 Exelan, the 2300 Exelan Flex also incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process. However, additional technology has been developed that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows.

The 2300 Exelan Flex's innovative technology has been production proven at numerous leading IC manufacturers and is leading the way for the 2300 Exelan Series to become the dominant dielectric etch solution for the semiconductor industry.