TCP® 9400DFM — Silicon Etch

Lam's TCP 9400DFM for 200—mm wafers is the most advanced silicon etch system available on the multichamber Alliance® platform. Based on Lam's production—proven Transformer Coupled Plasma™ technology, the TCP 9400DFM is designed to meet gate and STI etch requirements down to the 130—nm technology node. The system is capable of running multiple applications in situ (in the same chamber), which increases process flexibility, reliability, and productivity. A TCP 9400DFM kit is also available to upgrade the TCP® 9400PTX system.

Silicon etch applications are extremely critical because they form the gate, the outcome of which determines the performance of the finished device. As a result, gate etch carries stringent process requirements for CD uniformity, defectivity, and microloading in isolated and dense areas. In addition, in situ processing capability and applications, such as STI and spacer formation, require a large process window. In situ processing enables advanced applications such as STI etch, and it increases the efficiency of gate etch when BARC and mask open as well as the main etch are performed in the same chamber. In situ processing increases productivity, requiring fewer processing steps, reducing wafer moves, and lowering transfer overhead.

Critical gate and STI etch applications are further enhanced by chamber features such as SymFlo™, a symmetrical flow gas distribution system designed to deliver CD bias uniformity between isolated and dense features. The system also features a Voltage Control Interface™ (VCI™), a closed—loop system that enhances chamber matching capabilities by controlling ion bombardment, which directly influences CD and etch rates wafer to wafer and chamber to chamber.

The TCP 9400DFM system also incorporates Lam's unique Waferless AutoClean™ (WAC™) technology, which offers world-class mean time between cleans (MTBC) by maintaining a consistent chamber environment wafer to wafer. Benefits include reduced defects, higher yields, and improved chamber matching. An optional interferometric endpoint system provides repeatable endpoint capability to control etch processes for devices with ultrathin gate oxides of 20Ã. accurately.

The TCP 9400DFM offers upgrade capability for Lam's highly successful TCP 9400PTX, extending the system's capability to 130 nm with a variety of innovative technology enhancements. Lam has continued to maintain a leadership position in silicon etch, with the installed base of Lam's production-proven 9400 Etch Series exceeding 1,300 chambers installed at major fabs around the world.