TCP® 9600DFM — Conductor Etch

Lam's TCP 9600DFM extends high—density, low—pressure aluminum etch capability to sub—150—nm interconnect applications. The TCP 9600DFM combines superior system reliability and availability with new features that deliver excellent on—wafer performance.

Lam's TCP 9600DFM is a metal etch solution with industry—leading manufacturability. In addition to high throughput, new value—adding features extend the system's long mean time between cleans (MTBC) and mean time between failures (MTBF), both of which translate directly into high system uptime. The TCP 9600DFM also introduces hardware that offers low defectivity and optimum control of the etch chamber environment to ensure highly uniform process results for profile, critical dimension, and etch rates. For instance, a proprietary voltage control system maintains bias voltage at setpoint despite changes in process chemistry or minor differences that may exist from machine to machine in power delivery systems. That means the enhanced performance of the TCP 9600DFM is accompanied by more predictable etch system results. The new features also contribute to excellent repeatability, wafer to wafer, module to module, and system to system.

The TCP 9600DFM system integrates metal etch with microwave strip on the Alliance® multichamber platform. An all—aluminum wafer table in the microwave strip chamber combines wafer placement with optimal thermal management for reliable strip performance and corrosion control.

With high throughput and a low cost of consumables that keep total production costs low, Lam's TCP 9600DFM provides industry—leading availability and manufacturability for interconnect production at 150 nm and beyond.