C3™ Technology — Linear Single-Wafer Wet Clean

With continued device scaling driving smaller feature sizes and higher aspect ratios, as well as the introduction of new materials into semiconductor manufacturing process flows, device features are becoming more susceptible to damage from wet cleaning and drying. To meet these challenges, Lam Research’s C3 (Confined Chemical Cleaning™) technology provides highly selective residue removal without impacting sensitive device structures. This innovative technology combines linear wafer motion with chemical-driven single-wafer cleaning to remove residues with chemical exposure times on the order of a few seconds.  The cleaning exposure time is optimized for aggressive removal of the target materials, while limiting the impact on other materials for improved CD control and selectivities.