The objectives of this course are to provide the student with sufficient background in the fundamental concepts of plasmas, their applications in etch processes, and the design of the hardware by Lam Research Corporation for production processing. Upon completing this course, the student should be able to baseline, optimize, and trouble shoot the BKM versions of the process for any of the common films etched in the silicon chamber.

This Process Training Course provides a treatment of the plasma and the general properties of etch processing, as well as the specific production processes, etch mechanisms and process trends for the common conducting films.

This course is designed for equipment and process engineers who desire in-depth knowledge of the 2300 Conductor Etch processes.

• The plasma and process fundamentals sections enable the student to understand the jargon and concepts of today’s production etch processing.
• The hardware section informs the student of the purpose and function of the materials and design of the chamber.
• The process application sections demonstrate the application of fundamental principles, provide understanding and predictive capabilities through models and mechanisms, and summarize the accumulated knowledge of the product group in process trends.
• The enhanced problem solving capabilities will manifest themselves in robust production processes with large process windows resulting in improved uptime, reduced MTTR and process development cycle time.
  

Day 1:

• Plasma Fundamentals
• Process Fundamentals

Day 2:

• Hardware
• BARC & Trim Etch
• Mask Open Etch

Day 3:

• STI Etch
• Gate Etch
• Spacer Etch

For Process Engineers: No Prerequisite

For Hardware engineers: Etch Overview is recommended.

If you are interested in this course, please contact us for the latest schedule and availability.

Schedule and prices subject to change without notice. Please confirm with Lam.