Etch Training Courses

Lam DataAnalyzer
Course Number: 402-240350-241

Course Objectives:

The objective of this course is to provide the student with the basic understanding of how to operate Lam DataAnalyzer.

Course Description:

This Technical Training Course provides an introduction to the basic features of Lam DataAnalyzer. The principle techniques of trace plotting and trend charting are covered. The technique of moving from high level data review to the more comprehensive trace analysis is covered. The generation of a baseline is covered, as well as a brief introduction to Statistical Process Control. The last section reviews examining files from other various applications, such as Lam AutoPM TM and Dynamic Alignment. The use of these techniques for examining datalog and LDA compatible files are strengthened by various exercises with prepared data files.

Target Audience:

This course is designed for equipment and process engineers who desire to learn how to use the Lam DataAnalyzer software.

Benefits for
Class Participants:

  • Understand how to examine etch hardware datalog files with the detailed comparisons of analog trace data across multiple parameters and/or multiple wafer files.
  • Achieve the skill of reviewing large data collections for trends and outliers, and be able to quickly examine trace data from chosen files.Understand the option for examining large data sets while examining the data in the full analog view.
  • Learn the techniques for building a statistical model of good process /hardware performance by creating baseline files.
Agenda:

Day 1:

  • Introduction, purpose & capabilities
  • Plotting parameter trace data
  • Concatenation & trend data plotting
  • Construction baselines & SPC review
  • Overview of diagnostics & troubleshooting
Prerequisites:

There are no prerequisites for this course

Schedule:

If you are interested in this course, please contact us for the latest schedule and availability.

Notes:

Schedule and prices subject to change without notice. Please confirm with Lam.