Etch Training Courses

ESC Theory Of Operations and Performance Optimization
Course Number: 402-240350-810

Course Objectives:

The objective of this course is to provide the student with the ability to optimize the repair and use of Lam’s electrostatic chucks.

Course Description:

This course reviews the evolution of wafer clamping and provides a thorough discussion of the design, use, optimization, and troubleshooting of the 2300® Exelan Flex Dual Zone ESC as well as the Bipolar ESC in the 2300® Versys® family of chambers.

Target Audience:

This course is designed for equipment and process engineers who need to learn how to optimize the use of the ESC on Lam’s Etch Chambers.

Benefits for
Class Participants:
  • Understanding of the theory of operation and design of Lam’s electrostatic chucks.
  • Acquisition of the skills to optimize the performance of the electrostatic chuck.
  • Learn to adjust the chuck parameters to a specific process recipe.
  • Ability to use and optimize the plasma dechuck sequence in order to avoid wafer sticking.
  • Learn to use temperature tunable electrostatic chucks.

Agenda:

Day 1:

  • Evolution of Wafer Clamping
  • Theory of Operation
  • Exelan® Flex™ Dual Zone ESC
  • 2300 Versys® Bipolar ESC: Theory & Operation
  • Wafer Sticking in Metal Chambers
  • Tunable ESC
Prerequisites:

There are no prerequisites for this course
Schedule:

If you are interested in this course, please contact us for the latest schedule and availability.
Notes:

Schedule and prices subject to change without notice. Please confirm with Lam.